At their Computex 2025 booth, TeamGroup presented three conceptual cooling systems designed for SSDs utilizing the M.2 connector. While these innovations are not yet in mass production, they showcase novel approaches to address the overheating challenges of high-speed solid-state drives.
The T-Force AI-Flow X cooler appears as a standard passive heat sink, but its operation is based on thermoelectric technology (the Peltier effect) and it incorporates a concealed fan. According to the manufacturer, this cooling system is managed by a proprietary AI algorithm that dynamically optimizes its cooling efficiency.
The concept known as the T-Force GD120T SSD AiO Cooler is a liquid cooling loop designed to cool up to three SSDs simultaneously, with heat dissipation handled by a 120mm fan. A potential hurdle for its adoption might be the complexity of mounting it securely onto the motherboard.
The T-Force DUO360V2 CPU+SSD AiO Cooler system shares similarities with the previous concept but expands its cooling circuit to also encompass the computer’s processor. The overall heat dissipation capability of this integrated system is estimated to be between 150 and 250 W. Potential launch dates and pricing for all three of these conceptual cooling solutions remain unknown.
